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Edge-plating PCB with Half through holeEdge-plating PCB with Half through hole
CMOS (Complementary Metal-Oxide-Semiconductor) sensor, Bluetooth module -
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Capacitance embedded substrateCapacitance embedded substrate
Microphone, sensors, smart phone camera, fingerprint reader, Hearing Aid, Gastroscopy -
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Copper inlay embedded PCBCopper inlay embedded PCB
LED lamps, 5G small cell, data servers and the devices which need heat dissipation -
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mSAP (modified Semi Additive Process) substratemSAP (modified Semi Additive Process) substrate
Smart Phone, Tablet, Wearable devices -
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Coreless substrate- 3 LayersCoreless substrate- 3 Layers
CMOS (Complementary Metal-Oxide-Semiconductor) image sensor, Low Power DDR memory -
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Coreless substrate- 5 LayersCoreless substrate- 5 Layers
Smart Phone, Tablet, Bluetooth, RFID (Radio Frequency Identification) reader, Communications Satellite devices -
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High Frequency (HF) PCBHigh Frequency (HF) PCB
Automotive radar applications 、Global positioning satellite antennas 、Cellular telecommunications systems 、Patch antenna for wireless communications 、Direct broadcast satellites … -
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Medical HDI (High Density Interconnector) PCB [2 + N + 2]Medical HDI (High Density Interconnector) PCB [2 + N + 2]
Medical electronic products such as blood glucose machines, electronic blood pressure monitors, respirators, etc. -
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HDI (High Density Interconnector) PCB [4 + N + 4]HDI (High Density Interconnector) PCB [4 + N + 4]
Smart Phone, Tablet, Wearable devices, vehicle, storage device -
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HDI (High Density Interconnector) Substrate [1 + N +1]HDI (High Density Interconnector) Substrate [1 + N +1]
video game,、LCD TV、SSD、Wi Fi AP、Set Top Box
